Product Development Fundamentals.
1. Product Design Sections :
| a. | Electronic Engineering | Circuit Design, PCB Design, EDA. |
| b. | Mechanical Engineering | CAD, Tool and Die Design, Enclosure |
| c. | Software Engineering Firmware | PC ware, CASE, emulators |
2. Methods of Product Design :
| a. | Design Automation. | Design and Simulation with Computer. |
| b. | Computer Aided Design | Design on Computer, Breadboard test. |
| c. | Conventional Design. | Paper design with Breadboard test |
3. Criteria of Product Design :
| a | Ergonomics | User friendly Interface of controls, display, etc.. |
| b | EMI / RFI Ext. | Immunity to external electrical disturbance. |
| c | EMI / RFI Int. | Reduction of Internal electrical noise generation. |
| d | Input Cost | Selecting Cost effective components and methods. |
| e | Product Safety | Eliminating shock hazard, fire hazard or stress. |
| f | Corrosion res. | Resistance to Chemical Fumes, brine, gases etc.. |
| g | Reliability | Long Life reliability engineering, MTBF, stability. |
| h | Serviceability | Accessibility - Maintenance and repairs, Self test. |
| i | Vibration | Enclosure / Components to be vibration resistant . |
| j | Ease of Manfr. | Manufacture ease and provision for test and Calib.. |
| k | PC Interface | RS232, GPIB, etc. for PC Control and recording. |
| l | Upgrade Ease | Options, Software change, Hardware upgrades. |
| m | Quality | Design, Components, Production methods. |
| n | Accuracy | Specifications of performance and its stability. |
| o | Misuse-Abuse | Rugged design both electrically and mechanically. |
4. Criteria of Circuit Design :
| a | Technologies | Time proven technology and Standard Parts. |
| b | Reliability | Component Selection and Design Methods. |
| c | Modular | Allow for incremental upgrades and Service. |
| d | Safety Margins | Overrating for Voltage, threshold, speed, etc.. |
| e | Testability | Test Points, Isolating Jumpers, self test mode. |
| f | Isolation | High voltage isolation, User safety, grounding. |
| g | Thermal Limits | Dissipation Limit, Heatsinks, Shutdown, Size. |
| h | Protections | Fuses, Current Limit, Zeners, Varistors, Alarm. |
| i | Power economy | CMOS Designs, LCD Designs, SMPS, Portable. |
| j | Electrical Parts | Connector selection, Relays, Switches, PCB. |
| k | Precision | Accuracy, Resolution, Drift, Thermal stability. |